Card màn hình ASUS TUF Gaming Radeon RX 9070 OC Edition

Thương hiệu

ASUS

Graphic Engine

AMD Radeon™ RX 9070

Bus Standard

PCI Express 5.0

OpenGL

OpenGL®4.6

Video Memory

16GB GDDR6

Engine Clock

• OC mode(GPU Tweak III): up o 2670 MHz (Boos Clock)/up o 2190 MHz (Game Clock)
• Defaul mode: up o 2650 MHz (Boos Clock)/up o 2170MHz (Game Clock)

Stream Processors

3584

Memory Speed

20 Gbps​

Memory Interface

256-bi

Resolution

Digi al Max Resolu ion 7680 x 4320

Interface

Yes x 1 (Na ive HDMI 2.1b), Yes x 3 (Na ive DisplayPor 2.1a), HDCP Suppor Yes (2.3)

Maximum Display Support

4

NVlink/ Crossfire Support

No

Accessories

• 1 x TUF cer ifica e of Reliabili y
• 1 x TUF Gaming Graphics Card Holder
• 1 x TUF Velcro Hook & Loop
• 1 x TUF Fridge Magne
• 1 x Thank you card
• 1 x Speedse up Manual

Software

ASUS GPU Tweak III & Drivers: please download all sof ware from he suppor si e.

Dimensions

• 330 x 140 x 62.5 mm
• 13 x 5.5 x 2.5 inch

Recommended PSU

750W

Power Connectors

2 x 8-pin

Slot

3.125 Slo

AURA SYNC

ARGB

Note

• * Our wa age recommenda ion is based on a fully overclocked GPU and CPU sys em configura ion. For a more ailored sugges ion, please use he “Choose By Wa age” fea ure on our PSU produc page: h ps://rog.asus.com/even /PSU/ASUS-Power-Supply-Uni s/index.h ml
• * All specifica ions are subjec o change wi hou no ice. Please check wi h your supplier for exac offers. Produc s may no be available in all marke s. If you do no use he la es and curren specifica ions of ASUS produc s, you shall be liable for all loss and damage claimed by hird par y o ASUS based on false adver ising or any o her issues caused from using false specifica ions of ASUS produc s.
• * ‘Game Clock’ is he expec ed GPU clock when running ypical gaming applica ions, se o ypical TGP (To al Graphics Power). Ac ual individual game clock resul s may vary.
• * ‘Boos Clock’ is he maximum frequency achievable on he GPU running a burs y workload. Boos clock achievabili y, frequency, and sus ainabili y will vary based on several fac ors, including bu no limi ed o: hermal condi ions and varia ion in applica ions and workloads.