Card màn hình ASUS TUF Gaming Radeon RX 9070 XT OC Edition

Thương hiệu

ASUS

Engine đồ họa

AMD Radeon™ RX 9070 XT

Chuẩn Bus

PCI Express 5.0

OpenGL

OpenGL®4.6

Bộ nhớ

16GB GDDR6

Xung nhân

• OC mode(GPU Tweak III): up o 3080 MHz (Boos Clock)/up o 2540 MHz (Game Clock)
• Defaul mode: up o 3060 MHz (Boos Clock)/up o 2520 MHz (Game Clock)

Bộ xử lý luồng

4096

Tốc độ bộ nhớ

20 Gbps​

Giao diện bộ nhớ

256-bi

Độ phân giải

Độ phân giải Kỹ huậ Số Tối đa 7680 x 4320

Giao diện

Yes x 1 (Na ive HDMI 2.1b), Yes x 3 (Na ive DisplayPor 2.1a), Hỗ rợ chuẩn HDCP (2.3)

Hỗ trợ hiển thị tối đa

4

Hỗ trợ NVlink/ Crossfire

Không

Phụ kiện

• 1 x TUF cer ifica e of Reliabili y
• 1 x TUF Gaming Graphics Card Holder
• 1 x TUF Velcro Hook & Loop
• 1 x TUF Fridge Magne
• 1 x Thank you card
• 1 x Speedse up Manual

Phần mềm

ASUS GPU Tweak III & Trình điều khiển: vui lòng ải xuống ấ cả phần mềm ừ rang web hỗ rợ.

Kích thước

• 330 x 140 x 62.5 mm
• 13 x 5.5 x 2.5 inch

PSU khuyến cáo

850W

Đầu nối nguồn

3 x 8-pin

Khe cắm

3.125 Slo

AURA SYNC

ARGB

Ghi chú

• * Our wa age recommenda ion is based on a fully overclocked GPU and CPU sys em configura ion. For a more ailored sugges ion, please use he “Choose By Wa age” fea ure on our PSU produc page: h ps://rog.asus.com/even /PSU/ASUS-Power-Supply-Uni s/index.h ml
• * All specifica ions are subjec o change wi hou no ice. Please check wi h your supplier for exac offers. Produc s may no be available in all marke s. If you do no use he la es and curren specifica ions of ASUS produc s, you shall be liable for all loss and damage claimed by hird par y o ASUS based on false adver ising or any o her issues caused from using false specifica ions of ASUS produc s.
• * ‘Game Clock’ is he expec ed GPU clock when running ypical gaming applica ions, se o ypical TGP (To al Graphics Power). Ac ual individual game clock resul s may vary.
• * ‘Boos Clock’ is he maximum frequency achievable on he GPU running a burs y workload. Boos clock achievabili y, frequency, and sus ainabili y will vary based on several fac ors, including bu no limi ed o: hermal condi ions and varia ion in applica ions and workloads.